Advanced vehicular thermal management system can improve engine performance, minimize fuel consumption, and reduce emissions by harmoniously operating computer-controlled servomotor components. In this paper, a neural network-based optimal control strategy is proposed to regulate the engine temperature through the advanced cooling system. Presenter Asma Al Tamimi, Hashemite University
High Temperature Power Device and Packaging - The Technology Leap to Achieve Cost, Power Density and Reliability Target
The three major challenges in the power electronics in hybrid and electric vehicles are: System cost, power density and reliability. High temperature power device and packaging technologies increases the power density and reliability while reducing system cost. Advanced Silicon devices with synthesized high-temperature packaging technologies can achieve junction temperature as high as 200C (compared to the present limitation of 150C) eliminating the need for a low-temperature radiator and therefore these devices reduces the system cost. The silicon area needed for a power inverter with high junction temperature capability can be reduced by more than 50 - 75% thereby significantly reducing the packaging space and power device and package cost. Smaller packaging space is highly desired since multiple vehicle platforms can share the same design and therefore reducing the cost further due to economies of scale.