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Standard
2014-09-12
This document is an annex to EIA Engineering Bulletin SAB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). This document provided reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.
Standard
2014-09-12
This document is an annex to EIA Engineering Bulletin, SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugges Applications (the latest revision). The scope of this document is to establish the recommended minimum qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in many rugged, military, severe, or other environments.
Standard
2014-09-12
This document is an annex to EIA Engineering Bulletin SSB-1. Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications. This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.
Standard
2014-09-11
This specification covers Terminal Junction System (TJS) components which are used for interconnection of wiring and incorporation of passive components (see 6.1). These environment resistant components have in common the use of crimp type external pin contacts in accordance with AS39029/1 for Series I or crimp type external socket contacts in accordance with AS39029/22 for Series II. This family of TJS components is designed to operate continuously over a temperature range of -65 to 200 °C, using any combination of temperatures generated by the electrical load and ambient temperature so that the maximum internal hot spot, combined temperature, will not exceed the maximum specified for the class of TJS component, unless otherwise specified.
Standard
2014-09-05
This SAE Aerospace Information Report (AIR) discusses characteristics of data communications for the Joint Architecture for Unmanned Systems (JAUS). This document provides guidance on the aspects of transport media, unmanned systems and the characteristics of JAUS itself that are relevant to the definition of a JAUS transport specification.
Standard
2014-09-05
This document, the JAUS Compliance and Interoperability Policy (ARP6012), recommends an approach to documenting the complete interface of an unmanned system or component in regard to the application of the standard set. While non-SAE AS-4 JAUS documents are referenced in this ARP they are not within the scope of this document and should be viewed as examples only.
Standard
2014-08-26
This ARP specifies the recommended methods of marking electrical wiring and harnesses to aid in the positioning/routing of electrical wiring, harnesses and cable assemblies.
Standard
2014-08-20
This SAE Aerospace Information Report (AIR) defines the areas where incompatibility may exist between the selected wire and the electrical connector in which it is terminated and how to design for compatibility. Refer to ARP914 for a glossary of connection terms.
Viewing 1 to 30 of 3360