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2014-09-16
Technical Paper
2014-01-2141
Christine Ross, Michael Armstrong, Mark Blackwelder, Catherine Jones, Patrick Norman, Steven Fletcher
Abstract The Turboelectric Distributed Propulsion (TeDP) concept uses gas turbine engines as prime movers for generators whose electrical power is used to drive motors and propulsors. For this NASA N3-X study, the motors, generators, and DC transmission lines are superconducting, and the power electronics and circuit breakers are cryogenic to maximize efficiency and increase power density of all associated components. Some of the protection challenges of a superconducting DC network are discussed such as low natural damping, superconducting and quenched states, and fast fault response time. For a given TeDP electrical system architecture with fixed power ratings, solid-state circuit breakers combined with superconducting fault-current limiters are examined with current-source control to limit and interrupt the fault current. To estimate the protection system weight and losses, scalable models of cryogenic bidirectional current-source converters, cryogenic bidirectional IGBT solid-state circuit breakers (CBs), and resistive-type superconducting fault current limiters (SFCLs) are developed to assess how the weight and losses of these components vary as a function of nominal voltage and current and fault current ratings.
2014-09-16
Technical Paper
2014-01-2194
Ralf Cremer, Alfred Engler
Abstract The application of power electronics in aircraft is increasing in the latest aircraft developments. This contribution focuses on the recent advances of activities at Liebherr-Elektronik GmbH linked to power electronics: active power filter based on fast silicon carbide switches, open box design for unpressurized area, light weight housing, EMC management, partial discharge detection and mitigation, arc-fault detection and standardized innovative power cores with optimized sensors. These topics are derived from a roadmap based on beforehand identified key drivers. These key drivers will enable the future More Electric Aircraft (MEA) by focusing on weight, reliability and cost. New technologies as Silicon Carbide (SiC) and advanced integration will support this strategy.
2014-09-16
Technical Paper
2014-01-2142
Karen Davies, Patrick Norman, Catherine Jones, Stuart Galloway, Graeme Burt
Abstract Turboelectric Distributed Propulsion (TeDP) is actively being investigated as a means of providing thrust in future generations of aircraft. In response to the lack of published work regarding the system-level fault behaviour of a fully superconducting network, this paper presents key points from a two stage Failure Modes and Effects Analysis (FMEA) of a representative TeDP network. The first stage FMEA examines the qualitative behaviour of various network failure modes and considers the subsequent effects on the operation of the remainder of the network, enabling the identification of key variables influencing the fault response of the network. For the second stage FMEA, the paper focuses on the characterisation of the rate at which electrical faults develop within a TeDP network. The impact of system quench and associated rise in network resistance as well as network parameters such as network voltage and pre-fault current, on the resulting fault profile are also examined using a range of sensitivity studies.
2014-09-16
Technical Paper
2014-01-2167
Michael Usrey, Kevin Harsh, Alexander Brand, R. Steve McKown, Alireza Behbahani
Abstract Air Force Research Laboratory (AFRL) is pursuing development of advanced, distributed, intelligent, adaptive engine controls and engine health monitoring systems. The goals this pursuit are enhancing engine performance, safety, affordability, operability, and reliability while reducing obsolescence risk. The development of smart, high-bandwidth, high-temperature-operable, wide-range, pressure/temperature multi-sensors, which addresses these goals, is discussed. The resulting sensors and packaging can be manufactured at low cost and operate in corrosive environments, while measuring temperatures up to 2,552 °F (1,400 °C) with simultaneous pressure measurements up to 1,000 psi (68 atm). Such a sensor suite provides unprecedented monitoring of propulsion, energy generation, and industrial systems. The multi-sensor approach reduces control system weight and wiring complexity, design time, and cost, while increasing accuracy and fault tolerance. In situ pressure sensors reduce size and weight while eliminating failures associated with hypo-tube fouling.
2014-09-16
Technical Paper
2014-01-2207
Evgeni Ganev, William Warr, Keming Chen
Abstract This paper presents a novel method and system for an electric power alternating-current (AC)-to-direct-current (DC) converter employing composite technology. The term composite entails utilization of more than one type of conversion operating in parallel. In addition, background information for the prior art, based on conventional autotransformer rectifier units (ATRUs), and active converters are discussed. The major requirements of AC-to-DC converters from both functional and protection perspectives are provided. The concept of the new approach is defined. Comparative analysis between the new and old methods is documented. The performance features and technical details of the system parameters with respect to AC-to-DC converter system requirements are presented and discussed. Analysis, simulation results, and test data are included. Finally, the advantages of this technology, which nearly doubles power density compared to the state-of-the-art, are summarized and a conclusion included.
2014-09-15
Article
Germany's ZF has entered into a definitive agreement to acquire U.S.-based TRW Automotive Holdings Corp. for $13.5 billion, according to a Sept. 15 TRW press release. ZF has stated that TRW will be operated as a separate business division within ZF.
2014-09-15
Article
With the recent focus on the efficiency of vehicle electronics, automotive manufacturers are looking for tantalum capacitors with lower equivalent series resistance.
2014-09-15
Article
Excelfore enables simplified audio-video interconnectivity using Ethernet audio-video bridging, which leads to lower cost and system weight for infotainment systems in vehicles.
2014-09-15
Article
Sunex NoGhost 120dB lenses are the first and only lenses designed, optimized, and tested for use in cameras using high dynamic range image sensors, claims the company.
2014-09-15
Article
Q-Prime from Multek Flexible Circuits Inc. is a flexible circuit technology developed specifically for applications where efficient heat dispersion is required, and is especially useful for LED applications.
2014-09-15
Article
With its small size of 5.08 x 2.54 x 0.4 mm (0.20 x 0.10 x 0.02 in), high load capacity, and precision, Isabellenhütte’s gold-plated VMP-A resistor is suitable for automobile engine and transmission modules as well as power hybrids and power modules (DCB ceramic) in frequency converters. The VMP-A resistor is a member of the VMx precision resistor family with gold-plated contacts.
2014-09-12
Article
The new RR25 rotary speed sensor from Dynapar, which targets agricultural applications in the off-highway vehicle market, uses proven Hall-IC technology to provide reliable service in demanding environments where contaminants, corrosive chemicals, and high vibration are commonplace.
2014-09-12
Article
High-performance metamaterial antennas could be compact, lightweight, conformable, and stealthy.
2014-09-12
Standard
SSB1_001
This document is an annex to EIA Engineering Bulletin, SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugges Applications (the latest revision). The scope of this document is to establish the recommended minimum qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in many rugged, military, severe, or other environments.
2014-09-12
Standard
SSB1_002
This document is an annex to EIA Engineering Bulletin SSB-1. Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications. This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.
2014-09-12
Standard
SSB1_003A
This document is an annex to EIA Engineering Bulletin SAB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). This document provided reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.
2014-09-11
Standard
AS81714B
This specification covers Terminal Junction System (TJS) components which are used for interconnection of wiring and incorporation of passive components (see 6.1). These environment resistant components have in common the use of crimp type external pin contacts in accordance with AS39029/1 for Series I or crimp type external socket contacts in accordance with AS39029/22 for Series II. This family of TJS components is designed to operate continuously over a temperature range of -65 to 200 °C, using any combination of temperatures generated by the electrical load and ambient temperature so that the maximum internal hot spot, combined temperature, will not exceed the maximum specified for the class of TJS component, unless otherwise specified.
2014-09-11
WIP Standard
AS31021B
No scope available.
2014-09-09
Article
The marriage of vehicle electronics with mechanical systems is growing ever closer in intimacy, as the organizers of the first Convergence conference 40 years ago expected. Counseling on that relationship—and the crucial conflicts (e.g., simplicity vs. complexity) that must be resolved for a happy and resilient union—will be offered at SAE 2014 Convergence in the form of a seven-session panel program.
2014-09-09
Book
With current LED performance nearing or surpassing that of most traditional light sources, LEDs are now addressing most lighting applications (indoors, outdoors, transportation vehicles and so on), with prices coming down rapidly over the past three to five years. Advances in materials will also broaden LED consumption through improved performance. The report looks at the competing light-source technologies for automotive applications, including Halogen, HID/ Xenon, Combined HID and LED, LED technology, Organic LED (OLED) and Laser technology. It also examines the design flexibility and power savings that LEDs give designers, as well as the differing optics technology and related strict regulations. The Advanced Automotive Lighting and Vision Systems Report - 2014 Edition addresses uses for lighting in vehicles, looking at both exterior and interior applications and the unique set of challenges presented by each. It also looks at how lighting technologies are increasingly being combined with vision systems to create complete modules.
2014-09-09
Standard
J917_201409
This SAE Standard covers dimensions, performance parameters and nomenclature of a push-pull control cable used in inboard marine throttle and shift applications.
2014-09-08
Article
Additional $35 million will fund the company’s unique research center an additional five years, concentrating on a ‘safe transition’ to future of automated and connected vehicle technologies.
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